India to Become One of Biggest Chip Hubs in Next 5 Years: Ashwini Vaishnaw
India has commissioned four semiconductor
manufacturing units and in the next five years, the country will become one of
the biggest semiconductor hubs in the world, Union Railways and IT Minister
Ashwini Vaishnaw has said.
In a wide-ranging interview with IANS, the Union
Minister said that in the coming years, Prime Minister Narendra Modi will lay the
foundation for the further growth of the industry that will create thousands of
jobs.
“There is a clear policy on bringing
state-of-the-art technologies to India — be it Artificial Intelligence,
Electric Vehicles or semiconductors. Such policies have been made so that the
youth of the country can get more employment options and domestic startups can
be benefitted,” Ashwini Vaishnaw noted.
Semiconductor manufacturing remained only a dream
since 1960 and PM Modi finally fulfilled that dream.
“Four (chip) units have been commissioned today.
Technology is developing. Construction is going on fast. There is complete
preparation to release the first chip from Micron’s Sanand plant in December
itself,” said the Union Minister.
Moreover, the plant that is being set up in Assam
will use the chips made there in the world’s biggest EVs, Ashwini Vaishnaw
informed.
“In a way, India has a huge potential because we
are very strong in semiconductor design. In this spirit, PM Modi has taken a
pledge to bring semiconductor manufacturing to India and in the next five
years, India will become one of the biggest semiconductor hubs in the world,”
the IT Minister elaborated.
“The biggest semiconductor hub will be built in the
country. We will work for that effort with the same determination,” he said.
In March, PM Modi laid the foundation stone of
three semiconductor projects worth Rs 1.25 lakh crore.
The chip fabrication facility at the Dholera
Special Investment Region (DSIR) in Gujarat is being set up by Tata Electronics
Private Limited (TEPL) with a total investment of more than Rs 91,000 crore.
The Outsourced Semiconductor Assembly and Test
(OSAT) facility in Morigaon, Assam is being set up by TEPL for Semiconductor
Assembly, Testing, Marking and Packaging (ATMP), with a total investment of
about Rs 27,000 crore.
The OSAT facility in Sanand, Gujarat is being set
up by CG Power and Industrial Solutions Limited for Semiconductor Assembly,
Testing, Marking and Packaging (ATMP) with a total investment of about Rs 7,500
crore.
The first ‘Make in India’ chip is all set to arrive
in December, from the Rs 22,500 crore Micron semiconductor plant in Gujarat
that started work late last year.
(Courtesy:
IANS)
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