Intel Demonstrates AI Architectural Expertise at Hot Chips 2024
Intel, at Hot Chips 2024, showcased advancements across AI use
cases, from the data center, cloud and network to the edge and PC, while
covering the industry's most advanced and first-ever fully integrated optical
compute interconnect (OCI) chiplet for high-speed AI data processing. The
company also unveiled new details about the Intel Xeon 6 SoC (code-named
Granite Rapids-D), scheduled to launch during the first half of 2025.
"Across consumer and enterprise AI usages, Intel
continuously delivers the platforms, systems and technologies necessary to
redefine what's possible. As AI workloads intensify, Intel's broad industry
experience enables us to understand what our customers need to drive
innovation, creativity and ideal business outcomes. While more performant
silicon and increased platform bandwidth are essential, Intel also knows that
every workload has unique challenges: A system designed for the data center can
no longer simply be repurposed for the edge. With proven expertise in systems
architecture across the compute continuum, Intel is well-positioned to power
the next generation of AI innovation," said Pere Monclus, chief technology
officer, Network and Edge Group, Intel.
At Hot Chips 2024, Intel presented four technical papers
highlighting the Intel Xeon 6 SoC, Lunar Lake client processor, Intel Gaudi 3
AI accelerator and the OCI chiplet.
Built for the edge: The next-generation Intel Xeon 6 SoC
Praveen Mosur, Intel Fellow and network and edge silicon
architect, unveiled new details about the Intel Xeon 6 system-on-chip (SoC)
design and how it can address edge-specific use case challenges such as
unreliable network connections and limited space and power. Based on knowledge
gained from more than 90,000 edge deployments worldwide, the SoC will be the
company's most edge-optimized processor to date. With the ability to scale from
edge devices to edge nodes using a single-system architecture and integrated AI
acceleration, enterprises can more easily, efficiently and confidentially
manage the full AI workflow from data ingest to inferencing - helping to
improve decision making, increase automation and deliver value to their
customers.
The Intel Xeon 6 SoC combines the compute chiplet from Intel
Xeon 6 processors with an edge-optimized I/O chiplet built on Intel 4 process
technology. This enables the SoC to deliver significant improvements in
performance, power efficiency and transistor density compared to previous
technologies.
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