GIGABYTE Unveils X870E/X870 Motherboards
GIGABYTE,
announces the launch of its X870E and X870 series motherboards, purpose-built
for the most powerful AMD Socket AM5 platform on the market. Tailored
specifically for AMD Ryzen™ 9000 Series processors, these boards harness
cutting-edge AI technologies to unlock the full potential of AMD's latest Zen 5
architecture. With an array of high-performance features such as superior power
and VRM design, exclusive AORUS AI SNATCH technology, advanced DDR5 technology,
premium thermal management, next-gen Wi-Fi 7, and Dual USB4 connectivity, the
X870E and X870 series motherboards also maximize the performance potential of
the AMD's Ryzen™ X3D series processors.
The X870E and X870 motherboards feature GIGABYTE's enhanced power
design, an all-digital VRM design equipped with premium MOSFETs, chokes,
capacitors, and PWM controllers, supporting up to 20 power phases. The
introduction of exclusive AORUS AI SNATCH technology takes performance to the
next level, enabling one-click AI-powered overclocking, and optimizing DDR5
memory performance up to 8600 MT/s. GIGABYTE also enhances thermal solutions
like the DDR Wind Blade, reducing temperatures by up to 10°C, ensuring
stability under heavy loads, and pushing the limits of performance without
overheating. These innovations work in synergy to deliver the ultimate gaming
and multitasking experience.
Focusing
on DIY-friendly innovations, GIGABYTE's iconic EZ-Latch continues to evolve
with new upgrades, making PC building more convenient than ever. All AORUS
models now include complete DIY-friendly innovations from M.2 EZ-Latch Click,
M.2 EZ-Latch Plus to PCIe EZ-Latch Plus onboard, simplifying the build process
and ensuring swift, hassle-free installation. In addition, the entire lineup
supports dual USB4 Type-C connectivity with bandwidths up to 40Gbps each, Wi-Fi
7 for blazing-fast wireless performance, and the WIFI EZ-Plug design for easy
installation, ensuring future-ready high-speed connectivity.
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